Global Electronics will exhibit at the ITmedia Virtual EXPO 2023 Spring "Smart Factory EXPO," showcasing a variety of solutions based on the following themes. 【Exhibition Themes】 1. Visualization of Data 2. Industrial Networks SPE/WiFi 3. Sensors/Batteries for IoT Devices 4. FA Robot Solution Proposals 5. Power Supply AC-DC / DC-DC 【Exhibition Exclusive Content and Benefits】 - Download all solution proposal materials - A 1,000 yen Amazon gift card for survey respondents 【Exhibition Details】 Digital Comprehensive Exhibition for the Construction and Manufacturing Industries: ITmedia Virtual EXPO 2023 Spring Exhibition Theme: Smart Factory EXPO Dates: February 14, 2023 (Tuesday) 10:00 AM to March 17, 2023 (Friday) 11:59 PM (24-hour event) Venue: Online Participation Fee: Free (Pre-registration required)

[End] This seminar will feature instructors from three manufacturers of global electronics: TE Connectivity, Bourns, and Microchip Technology, who will present the latest information on their respective products and standards in an on-demand format. The viewing period is from May 26, 2022 (Thursday) to June 15, 2022 (Wednesday), making it convenient for you to watch at your leisure. Seminar Content Instructor: Atsushi Terada (TE Connectivity Japan LLC) SPE IEEE Standards and Networks, Implementation Benefits, SPE Connectors, etc. Instructor: Koichi Kurazawa (Bourns Asia Pacific Inc Japan) Chip LAN Transformers, Filters, TVS Diode Arrays for SPE, etc. Instructor: Yosuke Otsuka (Microchip Technology Japan KK) The Revolution of Single Pair Ethernet: 10BASE-T1S Introduction to Microchip SPE, etc. Viewing Period: May 26, 2022 (Thursday) to June 15, 2022 (Wednesday) Venue: On-demand distribution (registration required before viewing) Participation Fee: Free

Global Design Notes is a web series featuring useful technical information for engineers. As of January 26, 2022, the following titles are available for viewing: Oscilloscope Measurement Techniques Part 1: Probes Oscilloscope Measurement Techniques Part 2: Oscilloscope Rise Time and Bandwidth Power IC Evaluation Methods (Part 1) Power IC Evaluation Methods (Part 2) Isolation Amplifier Technical Notes Part 1 (planned for a total of 4 parts) Please visit us through the related links.

Global Electronics Co., Ltd. will collaborate with Parity Innovations Co., Ltd. and Metatecno Co., Ltd. to provide "Neonode's optical non-contact solutions," as well as services such as software development and support enhancement. This solution combines Neonode's optical non-contact touch sensors with next-generation imaging technology, enabling complete non-contact interaction with aerial images. The demand for non-contact technology has been increasing and becoming more apparent in the post-COVID era. However, the implementation of the system requires the selection of various electronic components such as sensors, LCDs, harnesses, and CPUs, as well as a hologram plate for aerial imaging. Additionally, depending on the Windows applications or embedded applications used, various driver developments may also be required. The lack of these development resources has posed challenges for system implementation. Through this collaboration among the three companies, we will address these challenges. Global Electronics will act as the authorized distributor for Neonode products and the various electronic components needed for internal configuration during implementation. Parity Innovations will provide the hologram plates for aerial imaging, while Metatecno will undertake the development of various applications and driver support, thus facilitating software implementation support.