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High-density interconnection system compliant with the COM-HPC standard.

Providing the best solution that meets the requirements for high-speed signals and their scalability in future embedded systems.

Products based on the "AcceleRate APF6/APM6 series" have been adopted as the standardized connector for "COM-HPC" (using two pairs of connectors with 400 pins in two rows for a total of 800 pins). We provide the best solution to meet the demands for high-speed signals and their scalability in future embedded systems. 【Features】 ■ Transmission speeds of up to 32Gbps per channel ■ Maximum of 4096 Gbps (2088Gbps per square inch) ■ Supports PCIe 5.0 (32GT/s) ■ Supports 100Gb (4 × 25Gb) Ethernet ■ BGA mounting ■ Fixtures and tools are available to prevent warping during mounting *For more details, please refer to the related link page or feel free to contact us.

Related Link - https://www.gec-tokyo.co.jp/components/samtec/com-…

basic information

【Applications】 ■ Datacom, Telecom ■ Embedded Systems, Servers ■ Medical Device Imaging ■ 5G Wireless Systems ■ 5G Equipment *For more details, please refer to the related links page or feel free to contact us.

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For more details, please refer to the related link page or feel free to contact us.

High-density interconnection system compliant with the COM-HPC standard.

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