Heat management solutions
A suitable solution that balances heat management and reliability! A compact design proposal that can also accommodate space constraints.
We would like to introduce our "Thermal Management Solution" created through the collaboration of SiC power semiconductors and high-performance heat sinks. This solution is compatible with discrete products from Microchip's power semiconductor line and offers thermal design support tailored to your usage conditions. Additionally, it features heat dissipation optimization to maintain product lifespan and performance, as well as compact design proposals that accommodate space constraints. 【Features】 ■ Compatible with discrete products from Microchip's power semiconductor line ■ Ideal combination with globally manufactured standard/custom heat sinks (e.g., 16PB056-01032, 20PB026-01032) ■ Thermal design support tailored to customer usage conditions ■ Heat dissipation optimization to maintain product lifespan and performance ■ Compact design proposals that accommodate space constraints *For more details, please download the PDF or feel free to contact us.
basic information
For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Inverters and converters ■ Solar power generation systems and battery storage devices ■ Industrial motor drive systems ■ Power modules for EV/HEV ■ Communication base stations and UPS systems *For more details, please download the PDF or feel free to contact us.
