Temperature sensor "BondSens"
It combines long-term stability and compatibility! It can also be embedded in semiconductor devices.
"BondSens" is a very compact platinum resistance thermometer with a size of 0.75×0.75mm, utilizing sensor technology from IST Corporation. It offers excellent cost performance, long-term stability, and compatibility, making it ideal for energy management, industrial equipment, and thermal compensation in medical devices. Additionally, it supports Au wire bonding, allowing for integration into semiconductor devices. 【Features】 ■ Dimensions: 0.75×0.75×0.3mm ■ Nominal resistance: 1,000Ω @0℃ ■ Operating temperature range: -50 to 150℃ ■ Long-term stability: <0.04% @1,000h @130℃ ■ Au wire bonding design *For more details, please download the PDF (English version) or feel free to contact us.
basic information
For more details, please download the PDF (English version) or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■Industrial Equipment ■Medical Devices ■Semiconductor Devices ■Temperature Compensation *For more details, please download the PDF (English version) or feel free to contact us.
