[Book] Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management (No. 2260)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
~ Substrate, Joining, Sealing, Cooling Technologies ~ ◎ A thorough explanation of Si, SiC, GaN, gallium oxide, the required characteristics in automotive environments, and implementation examples! ◎ Detailed guidelines for designing TIMs and thermal sheets that balance "thermal characteristics" and "operational reliability"! ---------------------------- ■ Table of Contents Chapter 1: Trends in the Development and Device Applications of Power Semiconductors Chapter 2: Design of Heat-Resistant and Heat-Dissipating Substrate Materials and Improvement of Reliability Chapter 3: Design of Joining Materials and Technologies and High-Temperature Connection Reliability Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation Chapter 5: Design of Heat-Resistant and Heat-Dissipating Resins and Expansion Relief Materials Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Techniques Chapter 7: Thermal Design of Power Devices and High-Heat-Resistant, High-Heat-Dissipating Packaging Technologies Chapter 8: Reliability and Thermal Characteristic Evaluation of Power Devices ---------------------------- ● Publication Date: August 30, 2024 ● Format: A4, 569 pages ● Authors: 60 individuals ● ISBN: 978-4-86798-030-9 ----------------------------
