[Book] Design and Application of Low Dielectric Constant and Low Dielectric Loss Materials (No. 2332) [Available for Preview]
TECHNICAL INFOMATION INSTITUTE CO.,LTD
～Responding to high-speed, large-capacity communication and high-speed transmission for AI servers～ ★A comprehensive overview of the development, challenges, and direction for high-frequency compatible semiconductor packaging! ★How to achieve a balance between dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Improvement of low dielectric properties and adhesion of polymer materials through molecular design Chapter 2: Development and application of additives to improve low dielectric properties and adhesion Chapter 3: Development and application of fillers and fiber materials to enhance low dielectric properties Chapter 4: Development of film materials with excellent dielectric properties Chapter 5: Development and application of low dielectric ceramic materials Chapter 6: Surface treatment technologies to achieve low dielectric properties Chapter 7: Development of substrates with superior low dielectric properties Chapter 8: Evaluation techniques for dielectric properties and physical properties of low dielectric materials －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4 size, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 －－－－－－－－－－－－－－－－－－－－－
