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[Available for preview] ~ Surface activated bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesive ~

- Adhesive materials with high heat resistance and thermal stress relaxation effects - Development of sheet-type adhesive materials aimed at large area bonding - Evaluation methods for mechanical properties of Ag nanoparticle sintered adhesive materials and joints - A new non-destructive testing method for detecting voids in power semiconductor joints ◎ Troubleshooting for solder mounting, case studies on the development of new conductive adhesives - Causes and countermeasures for soldering defects in semiconductor packages - Formation of micro solder pumps for advanced packaging - Reliability design and thermal fatigue prediction of solder joints in automotive electronic components - Case studies on the development and property evaluation of conductive adhesives using non-Ag fillers ---------------------------- ■ Table of Contents Chapter 1: Bonding and Adhesive Technologies for Advanced Semiconductor Packaging and Their Material Development and Reliability Evaluation Chapter 2: Development and Reliability Evaluation of Bonding Materials and Processes for Power Semiconductors Chapter 3: Development and Reliability Evaluation of Bonding Technologies and Materials in Electronic Devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 42 ● ISBN: 978-4-86798-164-1 ----------------------------