[Book] Development of Junction Technology and Materials for Semiconductor Devices (No. 2372)
[Available for preview] ~ Surface activated bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesive ~
Book Title: Development Trends and Reliability Evaluation of Joining Technologies and Materials for Semiconductor Devices －－－－－－－－－－－－－－－－－－－－－ ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, microLEDs, etc. This book includes case studies and verification results of new materials and processes aimed at the development of advanced semiconductors! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book ◎ Joining technologies for miniaturization and heterogeneous integration of advanced semiconductor packages - Application examples of surface-activated bonding in semiconductor device development - Recent development trends and challenges to be addressed in hybrid bonding technology - Surface activation for hybrid bonding and its experimental results - Effectiveness and potential of Cu pillar bonding technology using Ag diffusion bonding - Development of Au-coated Ag bonding wires for the transition to Au-free wire bonding - Principles and mechanisms of ultrasonic bonding and application examples in semiconductor packaging ◎ Joining materials and processes for next-generation power semiconductors to support high-temperature operation - Development of Cu sintering paste and its reliability evaluation - Examination of bonding processes considering the oxidation susceptibility of Cu - Development of new Cu-based solder materials for insulating heat dissipation substrates for power modules
basic information
- Adhesive materials with high heat resistance and thermal stress relaxation effects - Development of sheet-type adhesive materials aimed at large area bonding - Evaluation methods for mechanical properties of Ag nanoparticle sintered adhesive materials and joints - A new non-destructive testing method for detecting voids in power semiconductor joints ◎ Troubleshooting for solder mounting, case studies on the development of new conductive adhesives - Causes and countermeasures for soldering defects in semiconductor packages - Formation of micro solder pumps for advanced packaging - Reliability design and thermal fatigue prediction of solder joints in automotive electronic components - Case studies on the development and property evaluation of conductive adhesives using non-Ag fillers ---------------------------- ■ Table of Contents Chapter 1: Bonding and Adhesive Technologies for Advanced Semiconductor Packaging and Their Material Development and Reliability Evaluation Chapter 2: Development and Reliability Evaluation of Bonding Materials and Processes for Power Semiconductors Chapter 3: Development and Reliability Evaluation of Bonding Technologies and Materials in Electronic Devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 42 ● ISBN: 978-4-86798-164-1 ----------------------------
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88,000 yen (including tax) [shipping included] Various discount programs are available. Please contact us.
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P2
Delivery Time
P2
Model number/Brand name
2372 Semiconductor Junction
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