[Book] Development and Implementation Technology of Printed Circuit Board Materials (No. 2054BOD)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
■Table of Contents (Excerpt) Chapter 1: Future Trends of Implementation Components Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Device Boards Chapter 3: Car Electronics and In-Vehicle Boards Chapter 4: Development of Substrate Materials for Power Electronics Devices Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications Chapter 6: Development of High-Frequency Substrate Materials Chapter 7: Design of High-Frequency Substrates Chapter 8: Development of Flexible Printed Wiring Boards Chapter 9: Development of Component Embedded Substrate Technology Chapter 10: Printed Circuit Boards for Miniaturization and Thin Layering Chapter 11: Improvement of Connection Reliability Chapter 12: Fine Wiring Formation Technology Chapter 13: Via Formation for Substrate Stacking Chapter 14: Noise Countermeasure Technology －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: May 29, 2020 ●Authors: 65 ●Format: A4 Size, 713 Pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
