[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
★ A Comprehensive Explanation of Heat Problem Solutions Due to High-Speed Performance of Semiconductors and High-Density Device Implementation! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Design of Heat Sinks and Miniaturization with High Thermal Conductivity Chapter 2: Design of Heat Pipes and Miniaturization, Improvement of Thermal Transport Efficiency Chapter 3: Development and Application of Various TIM Materials Chapter 4: Development of High Heat Dissipation and High Thermal Conductivity Substrates Chapter 5: Development of High-Efficiency Cooling Technologies Chapter 6: Thermal Simulation Technologies for Electronic Device Design Chapter 7: Thermal Conductivity, Temperature Measurement, and Know-How Chapter 8: Heat Dissipation Technologies for Printed Circuit Boards Chapter 9: Heat Dissipation and Cooling Technologies for 5G and Information Communication Devices Chapter 10: Thermal Management Technologies in Sensor Design Chapter 11: Heat Dissipation and Cooling Technologies for Power Electronics Chapter 12: Heat Dissipation and Cooling Technologies for EV Batteries Chapter 13: Heat Dissipation Design for Automotive Electronics －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: July 30, 2021 ● Format: A4, 676 pages ● Authors: 62 ● ISBN: 978-4-86104-852-4 －－－－－－－－－－－－－－－－－－－－－ * For details, please download the catalog. * "Free preview" is available.
