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Technical Specialty Books - Low Dielectric Properties, Low Thermal Expansion, Transparency, Adhesion and Bonding Properties, Molding Properties -

■ Table of Contents Chapter 1: Synthesis, Design, Structure, Properties, and Characteristics of Various Polyimides Chapter 2: Transparency of Polyimides, Improvement of Optical Properties, and Application Development in Optical Devices Chapter 3: Reduction of Dielectric Loss in Polyimides and Applications in Electronic Circuit Boards and Electronic Devices Chapter 4: Surface Modification of Polyimides, Wiring Formation, and Improvement of Adhesion Chapter 5: High Thermal Conductivity of Polyimides and Application Technologies for Insulating Materials Chapter 6: Application Technologies of Polyimides in Energy Devices and Chemical Processes Chapter 7: Application Technologies of Polyimides in Aerospace and Structural Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: August 31, 2022 ● Authors: 57 ● Format: A4 size, 566 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-887-6 　　↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available 　　　　　 Price: 44,000 yen (tax included) ISBN: 978-4-86798-063-7 　　　　　 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－