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Composite precision parts processing for electronic devices with multi-process and multi-layer bonding.

Achieving cost reduction through component integration! Contributing to the miniaturization of electronic devices [Punching processing of film, double-sided tape, cushioning, heat dissipation sheets, and copper foil tape].

In the electronics industry, there is a constant demand for miniaturization and high performance of products. To efficiently achieve multiple functions within a limited space, it is important to increase the integration of components. Traditional configurations with a large number of parts have faced challenges such as increased assembly labor, complexity in material management, and rising costs. Our "multi-process, multi-layer composite precision parts processing" addresses these issues and contributes to the miniaturization and performance enhancement of electronic devices. 【Application Scenes】 - Smartphones - Tablet devices - Wearable devices - Other small electronic devices 【Benefits of Implementation】 - Realization of integration and miniaturization - Reduction in assembly labor - Simplification of material management - Cost reduction (lower manufacturing costs)

Related Link - https://gorinpki.co.jp/

basic information

【Features】 - Multi-layer structure - High-precision punching processing - Multi-process compatibility - Customization support - Integration and miniaturization 【Our Strengths】 Gorin Packing is a company that collaborates with customers to create the "desired shape" centered around punching processing (press processing of soft materials). We value responding as flexibly as possible to inquiries ranging from precision processing to prototypes and short delivery times. For designers, we support the ease of development by suggesting material selection and prototypes tailored to their applications. For purchasers, we alleviate concerns about stable procurement and costs with a system that can handle everything from small lots to mass production. For manufacturers, we contribute to improved assembly and quality on-site with processing precision that emphasizes ease of handling.

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Applications/Examples of results

【Typical Materials Used】 ■ Double-sided tape: Fixing, adhesion, waterproofing ■ PET film: Insulation, optical applications ■ Conductive film: EMC measures ■ Foam and sponge: Cushioning, vibration damping, waterproofing ■ Copper foil and aluminum foil: Heat dissipation, conductivity ■ Non-woven fabric and paper materials: Spacers, sound absorption ■ Elastomer and heat dissipation sheets: Heat dissipation, impact resistance *For more details, please download the PDF or feel free to contact us.

Multi-process and multi-layer bonded complex precision parts processing.

PRODUCT

[Proposal] Composite Proposal Catalog - Olympic Packing

TECHNICAL

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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.