Composite precision parts processing for multi-process and multi-layer bonding in semiconductor manufacturing.
Our packing integration technology achieves cost reduction through component integration! [Punching processing of film, double-sided tape, cushioning, and heat dissipation sheets]
In the semiconductor manufacturing industry, there is a demand for miniaturization and high performance of products. In microfabrication, the precision and reliability of components are crucial, as even slight misalignments or foreign objects can significantly impact product performance. Our "multi-process, multi-layer bonded composite precision parts processing" addresses these challenges and provides high-quality products. 【Application Scenarios】 - Packing for wafer transport - Gaskets for semiconductor manufacturing equipment - Protective materials for fine components 【Benefits of Implementation】 - High-precision component supply in microfabrication - Reduced risk of foreign object contamination - Improved product yield
basic information
【Features】 - Multi-layer structure - High-precision punching processing - Multi-process compatibility - Customization support - Integration and miniaturization 【Our Strengths】 Gorin Packing is a company that collaborates with customers to create the "desired shape" primarily through punching processing (press processing of soft materials). We value being as flexible as possible in responding to inquiries, from precision processing to prototypes and short delivery times. For designers, we support ease of development by suggesting material selection and prototypes tailored to their applications. For purchasers, we alleviate concerns about stable procurement and costs with a system that can handle everything from small lots to mass production. For manufacturers, we contribute to improved assembly and quality on-site through processing precision that emphasizes ease of handling.
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Applications/Examples of results
【Typical Materials Used】 ■ Double-sided tape: Fixing, adhesion, waterproofing ■ PET film: Insulation, optical applications ■ Conductive film: EMC countermeasures ■ Foam and sponge: Cushioning, vibration damping, waterproofing ■ Copper foil and aluminum foil: Heat dissipation, conductivity ■ Non-woven fabric and paper materials: Spacers, sound absorption ■ Elastomer and heat dissipation sheets: Heat dissipation, impact resistance *For more details, please download the PDF or feel free to contact us.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.