Processing of heat dissipation sheets for cooling manufacturing equipment used in semiconductor production.
We solve the thermal challenges of manufacturing equipment with optimal heat dissipation sheet processing.
In semiconductor manufacturing equipment, the heat generation from components such as CPUs and GPUs has increased due to higher performance, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or housing. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shaping them according to the installation locations. We offer solutions to thermal challenges for various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/housings. [Application Scenes] - Cooling of heat-generating components (such as CPUs and GPUs) within semiconductor manufacturing equipment - Temperature management of precision devices - Stable operation and longevity of equipment [Benefits of Implementation] - Suppression of temperature rise in heat-generating components - Maintenance and improvement of equipment performance - Reduction of failure risks
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**Features** - Optimal selection of thermal conductive sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance/reliability, etc.) - Diverse processing tailored to component shapes and assembly processes (square and irregular cutting, holes and notches, multiple pieces, tabbed processing, adhesive processing and lamination, half-cutting, etc.) - Supply forms capable of supporting everything from prototypes to mass production (sheet supply, roll supply) - Consistent support from material selection to shape processing and supply - Technical expertise in punching soft materials **Our Strengths** Olympic Packing specializes in punching soft materials, realizing customers' desired shapes with reliable technology. We flexibly respond to inquiries ranging from precision processing to prototypes and short delivery times, making us a trustworthy partner in supporting your manufacturing needs. Our proposals are tailored to the needs of design, purchasing, and manufacturing personnel, contributing to smoother development, stable procurement, and improved assembly on-site.
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Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
Applications/Examples of results
■CPU・GPU: Heat transfer between high-heat-generating components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, notches, with tabs, and also consider assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.