Heat management in artwork design

In circuit board design, the temperature rise caused by heat-generating components and high current density patterns significantly impacts the reliability and lifespan of electronic devices. This category explains practical know-how for artwork design based on thermal measures, including the arrangement of heat sources, heat dissipation pattern design, optimization of through-holes, and selection of vias and copper foil thickness for heat dissipation. By integrating thermal simulation with design, efficient and reproducible thermal design becomes possible. We will introduce design methods to prevent thermal issues in advance and achieve both product reliability and performance.