Product Services
Featured product
Products/Services
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FPGA design and development(2)
Our company offers a one-stop solution for all processes of FPGA development, from requirement definition, specification formulation, logical design, RTL design, verification, implementation on FPGA, to evaluation. We have particular strengths in image processing, sensor control, and communication interfaces, and we can broadly support FPGAs from various manufacturers such as Xilinx (AMD), Intel (formerly Altera), and Lattice. We respond flexibly to requests, ranging from contracts for RTL design only to board development and systemization with an eye toward mass production. We emphasize balancing design quality and development speed, providing high-reliability and high-performance solutions for increasingly complex FPGA designs.
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Power supply unit design and development(1)
We would like to introduce our "Power Supply Unit Design and Development."
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Wireless communication module development(1)
We would like to introduce our "Wireless Communication Module Development."
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Artwork design(7)
Our artwork design service provides high-quality PCB design that takes into account noise reduction, thermal design, and high-speed signal transmission, in collaboration with circuit designers. We cater to a wide range of fields, including FPGAs, high-speed digital circuits, power circuits, and analog circuits, and we have a proven track record in multilayer boards and high-density packaging. We can consistently support everything from prototyping to mass production and are flexible in design using various CAD tools such as Xpedition, CR-8000, and Altium Designer. Our artwork design balances functionality and manufacturability, contributing to the optimization of product development.
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Noise countermeasures in artwork design(1)
In recent years, the adoption of DC/DC converters with excellent conversion efficiency has become common in electronic devices due to power-saving measures and the use of low-voltage ICs. However, on the other hand, issues such as noise generation and adverse effects on other circuits have become challenges, making noise countermeasures at the artwork design stage extremely important. Noise can vary significantly based on PCB patterns, including GND routing, minimizing current loops, and component placement. Our company conducts verification experiments using actual DC/DC circuits to visualize the differences in noise based on design quality with data. We propose optimal artwork designs from both theoretical and practical perspectives. We provide reliable technology to support the development of noise-resistant products.
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Heat management in artwork design(1)
In circuit board design, the temperature rise caused by heat-generating components and high current density patterns significantly impacts the reliability and lifespan of electronic devices. This category explains practical know-how for artwork design based on thermal measures, including the arrangement of heat sources, heat dissipation pattern design, optimization of through-holes, and selection of vias and copper foil thickness for heat dissipation. By integrating thermal simulation with design, efficient and reproducible thermal design becomes possible. We will introduce design methods to prevent thermal issues in advance and achieve both product reliability and performance.
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High-speed transmission line design in artwork design(1)
To achieve stable transmission of high-speed signals, the design of the transmission path is extremely important. This category explains essential design techniques for high-speed transmission, including impedance control of signal lines on the substrate, suppression of crosstalk, prevention of reflections, and optimization of refraction and delay. As miniaturization and high-density mounting progress, practical know-how is widely introduced, such as pattern layout to maintain signal quality and minimize noise, placement of ground planes, and innovative layer configurations. This provides a foundation for artwork design that maximizes the high-speed communication performance of the system.
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Large-scale circuit design in artwork design.(6)
Large-scale circuit design requires advanced artwork design techniques in PCB design, which involves numerous components and complex wiring. It addresses many challenges that affect design quality, such as signal integrity, power noise mitigation, thermal design, and layer structure optimization, while achieving high-density implementation within limited PCB space. Furthermore, it is important to adhere to design rules and utilize automatic routing tools, considering manufacturability and reliability. Artwork design specialized for large-scale circuit design aims to leverage advanced know-how and experience to achieve stable performance and compatibility with mass production.
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Circuit design support(6)
To meet the growing needs of advanced electronic devices, engineers with specialized knowledge and extensive experience provide comprehensive support for all phases of circuit design. From the planning stage to detailed design and prototype evaluation, we achieve improvements in design quality and reductions in development time. We flexibly respond to customer specifications and challenges, offering optimal circuit configurations and component selections, as well as comprehensive support that includes troubleshooting, strongly promoting the success of product development.
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Substrate manufacturing(9)
Our circuit board manufacturing service realizes the production of high-quality printed circuit boards that meet diverse needs, focusing on small quantities. We can accommodate various types of boards, including thick copper boards, multilayer boards, and flexible boards, by introducing the latest technologies that enhance design flexibility. In particular, thick copper boards are suitable for high current applications and excel in heat dissipation and durability. We also support miniaturization and high-density mounting of circuit boards, allowing for flexible responses to complex circuit designs. Under a strict quality control system, we deliver reliable products and strongly support our customers' product development and mass production. ■ Types of Boards Handled - Multilayer boards (FR-4) - Flexible boards (FPC) - Rigid-flex boards - Build-up boards - High-frequency boards - Glass boards - Ceramic boards
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Bear chip implementation(1)
Our company has established a consistent production system from circuit board design to bare chip mounting, and we have a wealth of experience in high-difficulty projects. Utilizing technologies such as wire bonding and flip chip mounting to ensure the overall characteristics of the module, we provide support with a focus on cost and delivery time from the planning stage. We accommodate a wide range of tasks, including bonding with Au, Al, and Cu wires, various bump formations, ACF connections, die bonding, and resin encapsulation. We are also capable of designing and implementing special optical axis alignment optical element die mounts and multi-chip packages. There is a possibility that we can solve projects that other companies have declined, thanks to our extensive know-how. If you have any concerns regarding bare chip mounting, please feel free to consult us.
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BGA rework(1)
Our BGA rework service safely and quickly replaces and repairs devices and substrates without causing damage, even on lead-free assembled boards. Utilizing skilled technicians with extensive experience and the latest equipment, we conduct thorough pre-verification through temperature profiling. By employing area heaters and spot heaters, we completely prevent land delamination with minimal heating. Furthermore, we accommodate jumper modifications and provide high-quality, short-term services for detailed tasks such as wiring from 0.5mm pitch QFP leads and adding resistors in tight spaces. Because the skill of our technicians is a crucial process that affects quality and delivery time, we finish each task with care.