Substrate manufacturing

Substrate manufacturing
Our circuit board manufacturing service realizes the production of high-quality printed circuit boards that meet diverse needs, focusing on small quantities. We can accommodate various types of boards, including thick copper boards, multilayer boards, and flexible boards, by introducing the latest technologies that enhance design flexibility. In particular, thick copper boards are suitable for high current applications and excel in heat dissipation and durability. We also support miniaturization and high-density mounting of circuit boards, allowing for flexible responses to complex circuit designs. Under a strict quality control system, we deliver reliable products and strongly support our customers' product development and mass production. ■ Types of Boards Handled - Multilayer boards (FR-4) - Flexible boards (FPC) - Rigid-flex boards - Build-up boards - High-frequency boards - Glass boards - Ceramic boards
1~9 item / All 9 items
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High-frequency substrate
Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.
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Substrate manufacturing
High quality, short delivery times, and responsiveness that can only be achieved by a fabless company!
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[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board
Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!
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[Artwork Design/Circuit Board Design Work] OPV-driven Sensor Node Terminal
Support for the development of 28.5GHz band ICs for 5G base stations, as well as compatibility with M.2 extension cables (400mm) for PCIe Gen5!
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Build-up substrate
Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.
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Rigid-flexible substrate
A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.
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Circuit board design and pattern design
Guaranteed operation with a single prototype! Proven track record from product planning to design and mass production launch.
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Transparent flexible substrate
Ideal for wearable devices! Applicable to medical and smartphones, etc.
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Heat dissipation substrate
Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.
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