Build-up substrate
Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.
We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.
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Our company specializes in circuit board design. With skilled circuit designers handling the design, we believe you will experience a high level of satisfaction in terms of performance and quality. Unlike typical circuit board design companies, we: 1. Have a deep understanding of circuits and digital circuits 2. Can visualize current flow 3. Thoroughly scrutinize device datasheets during the design process Our motto is to conduct designs without rework, contributing to our customers in terms of performance, quality, and delivery time! Additionally, as a fabless manufacturer, we propose the most suitable manufacturing methods tailored to our customers' specifications, costs, and deadlines. We handle FPGA development, power systems, motors, wireless, firmware, and software, allowing us to undertake comprehensive system development projects. We are also happy to accommodate small quantities, such as prototypes and component development products.