Manual and Automatic Bonding Device 'BJ653'

Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

last updated Aug 06, 2026

BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

last updated Aug 06, 2026

High-speed fully automatic fine wire bonder 'BJ855'

Expansion of productivity! The large work area allows for batch processing of multiple devices.

last updated Aug 06, 2026

Fully Automatic Thick Wire Bonder 'BJ955/959'

A controllable current transducer and frequency that continuously monitors wire deformation.

last updated Aug 06, 2026