Notice of Participation in the 5th Nagoya Nepcon Japan (Electronics Development and Implementation Exhibition) [HIWIN]

ハイウィン

We will be exhibiting at the 5th Nagoya Nepcon Japan (Electronics Development and Implementation Exhibition) held at Port Messe Nagoya from October 26, 2022. ◇ Event Period October 26 (Wed) to 28 (Fri), 2022, 10:00 AM to 5:00 PM ◇ Exhibition Venue Port Messe Nagoya, New No. 1 Exhibition Hall ◇ Booth Number 14-20 ◇ Featured Exhibits ■ High-performance, high-rigidity wafer transport robot Achieves both high performance and affordability / Reduces takt time / Long-lasting due to no gears. Major components, including expensive DD motors, are manufactured and developed in-house. Our high-quality and reasonably priced robot, which integrates hardware and software, contributes to the differentiation of your products. You can see a demo unit of the wafer transport robot at our exhibition booth. ■ Unmatched thinness and large hollow diameter! We will also exhibit the industry’s thinnest class DD motor, the DMT series. With a thickness of about 22mm, it contributes to increased design freedom with its overwhelming large hollow diameter and excellent positioning accuracy. When combined with our linear motors, it is relatively easy to assemble a high-precision positioning XYθ stage with an overall height of about 250mm.

High-performance, high-rigidity wafer transport robot

Highwin ball screw i4.0BS equipped with condition visualization system

Date and time Wednesday, Oct 26, 2022 ～ Friday, Oct 28, 2022
10:00 AM ～ 05:00 PM
Capital Port Messe Nagoya New No. 1 Exhibition Hall
Entry fee Charge If you use the e-invitation ticket, you can enter for free. Please check the details and application button below.

Related product information

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High precision & high rigidity! Wafer transport robot compatible with 2-12 inch wafers [E Series]

Single Arm / Double Arm Arm Length: 135mm / 165mm / 185mm The end effector supports vacuum suction, gripping, and inverting methods.
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For details, please refer to the catalog or contact us.
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For more details, please refer to the PDF document or feel free to contact us.