Notice of Participation in SEMICON Japan【HIWIN】
ハイウィン
We will be exhibiting at "SEMICON Japan 2022," which will be held at Tokyo Big Sight from December 14, 2022. ◇ Event Period December 14 (Wednesday) to December 16 (Friday), 2022, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 1915 ◇ Featured Exhibits ■ Wafer Transport Robot Key components, including DD motors and high-rigidity cross roller bearings, are manufactured and developed in-house, achieving both high performance and affordability. Suitable not only for wafer transport but also for PCB and glass substrate transport applications. With no gears, it experiences less aging and has fewer parts, reducing maintenance labor. ■ Ultra-Thin DD Motor [DMT Series] The industry’s thinnest class DD motor, the [DMT Series], is 22mm thick. Its overwhelming thinness and large hollow diameter contribute to greater design flexibility for equipment. It boasts high resolution and excellent positioning accuracy, with zero backlash without gears. Additionally, its unique circuit design enables high torque. A large model, DMTK3 (dimensions: 520*520*30mm, hollow diameter 340mm), which will be released soon, will also be on display.
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Date and time Wednesday, Dec 14, 2022 ～ Friday, Dec 16, 2022
10:00 AM ～ 05:00 PM
- Capital Tokyo Big Sight, East Hall 2, 1915
- Entry fee Free Please register for attendance and the seminar using the details and application button below.
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