ハイウィン Official site

Notice of Participation in SEMICON Japan 2021 [HIWIN]

ハイウィン

We will be exhibiting at "SEMICON Japan 2021," an international exhibition related to the semiconductor manufacturing supply chain, including manufacturing technologies, equipment, and materials. We will showcase our wafer transfer robots equipped with DD motors, as well as electric grippers that can be used immediately with collaborative robots. Our company, which develops and manufactures linear guide devices, motors, drivers, and controllers in-house, will propose total solutions that contribute to each process of semiconductor manufacturing. We invite you to visit our booth when you attend. ◇ Event Dates December 15 (Wednesday) - 17 (Friday), 2021, 10:00 AM - 5:00 PM ◇ Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 2409 ◇ Featured Products/Services ■ Wafer Transfer Robot "RW Series" ■ Robot Technology Center Mobile Lab ■ AC Servo Motors, Linear Motors, DD Motors