ハイウィン Official site

Notice of Participation in NEPCON Japan [HIWIN]

ハイウィン

We will be exhibiting at the "36th NePCON Japan - Electronics Development and Manufacturing Expo" held at Tokyo Big Sight (Tokyo) from January 19, 2022. 【"Supporting Next-Generation Manufacturing" - The Best Partner for Industry 4.0】 We will showcase our wafer transport robots equipped with DD motors, which are active in semiconductor manufacturing equipment, as well as high-precision positioning systems compatible with mounting and inspection/testing equipment. We will propose a total solution unique to our company, which develops and manufactures various motors, drivers, and controllers from linear guide devices. We invite you to visit our booth. ◇ Event Period January 19 (Wed) - 21 (Fri), 2022, 10:00 - 18:00 (Only on the final day until 17:00) ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 13-12 ◇ Featured Exhibits ■ High performance and reasonable Wafer transport robot: RW series ■ A rich product lineup that realizes all positioning mechanisms Gantry mechanism combining linear and rotational motion ■ Capable of constructing low-profile XYΘ stages Industry's thinnest class DD motor: DMT series