Wire Bonding Inspection "Wire Inspection Pro"
Ideal for re-inspection of lot-out products and finish confirmation for each manufacturing lot!
"Wire Inspection Pro" is a technology that inspects the wire shapes inside IC chips using X-ray imaging and automatically determines defects such as wire bonding disconnections, shorts, and bends. By utilizing this technology, it is possible to automate the inspection of defects occurring inside ICs. Custom software can be developed based on the inspection object and inspection specifications. 【Features】 ■ By linking the developed wire inspection software with the X-ray inspection software (BSFM), automatic inspection of internal IC images is achieved. ■ Custom software can be developed based on the inspection object and inspection specifications. *For more details, please refer to the related links or feel free to contact us.
basic information
For more details, please refer to the related links or feel free to contact us.
Price range
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Applications/Examples of results
【Applicable Uses】 ■ Inspection of defects inside IC chips that occur after wire bonding processes (such as IC molding) ■ Re-inspection of lot-out products ■ Confirmation of finishing for each manufacturing lot *For more details, please refer to the related links or feel free to contact us.
