Selectable image resolution! Wafer chip appearance inspection device (after dicing)
Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.
The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Device Specifications (Example)】 ■Camera ・3CMOS Color Area Camera with 3.2 Megapixels (Inspection) ・16,000 Pixel Monochrome Line Camera (Press Can) ■Device Size ・1,450W × 1,640D × 1,800H mm ・Excluding Patlite and HEPA *For more details, please refer to the PDF document or feel free to contact us.
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Delivery Time
Applications/Examples of results
【Inspection Items】 ■Dicing defects (cracks, chips), scratches, discoloration, foreign substances, pattern misalignment, pattern missing, residual resist, coating defects, etc. *For more details, please refer to the PDF document or feel free to contact us.
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[Newsletter Sent] Image resolution can be selected! Wafer chip appearance inspection device (after dicing) / Hubrain Inc.
Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels. The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip rejection function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Rejection time: 3 to 6 chips/second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips/second for in-car applications
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We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.
We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.
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Notice of Website Renewal / Hubrain Inc.
Thank you very much for using the website of Hubrain Inc. We would like to inform you that we have renewed our website. In this renewal, we have completely revamped the structure and design to make it easier for everyone to find the information they need. We will continue to strive to provide useful information and enhance our content for all users. We appreciate your continued support. Business Activities - Wafer and chip appearance inspection equipment - Tray packing machine with front and back inspection functions - Tray-type component appearance inspection machine - Tray-type appearance inspection machine - parallel processing type - Green sheet appearance inspection machine - parallel processing type - Chip component six-sided image inspection machine - PV module appearance inspection machine - PV cell appearance inspection machine - OPC drum surface defect inspection equipment - Pellet and powder foreign matter inspection equipment - Sheet appearance inspection - Container outer surface printing inspection - Container inner surface inspection machine - Multifunctional image inspection machine - Plastic syringe inspection equipment, etc.
