Aibit Inc. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2025" held at Acurie Himeji in Himeji City, Hyogo Prefecture. This exhibition is an event showcasing advanced equipment from major domestic manufacturers specializing in automation of the later processes. We are planning to hold a seminar on "Defect Analysis of Assembled Boards Using X-rays." We sincerely look forward to your visit.

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting processes, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in through-holes." We look forward to your attendance. 【Seminar Content】 We will discuss methods for analyzing defective mounting boards using X-ray equipment, with variations in defect shapes for each case. Many cases can reveal the causes of defects through analysis of defective boards using X-ray images. We aim to introduce the latest X-ray inspection methods, X-ray defect analysis techniques, and methods for identifying the causes of defects. Selected defect cases to be covered include: (1) Defects caused by bubbles in inner layer vias (normal operation when pressure is applied from above the BGA) (2) Defects caused by cracks in through-holes (cracks occur due to thermal expansion in the furnace, leading to defects upon removal from the furnace, which are considered mounting defects).

Aibit will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2023" held at the West Japan General Exhibition Center. This exhibition focuses on automation in the later stages of production and will showcase new equipment from major domestic manufacturers. At our booth, we plan to display the 3D X-ray stereo observation device "FX-400tRX," which comes standard with a chip counter function. We sincerely look forward to your visit.

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2022 in Nagoya," held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition will clearly showcase key equipment aimed at automation in the context of the current demand for product quality assurance in the implementation and assembly processes. We plan to exhibit the inline X-ray inspection system "ILX-2000," which can inspect bottom-mounted soldered components such as BGA using X-ray stereo technology, as well as the offline X-ray inspection system "FX-300tRX2," which separates the front and back surfaces of printed circuit boards in about 4 to 5 seconds using X-ray stereo technology. We sincerely look forward to your visit.

Our company will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2022" held at the Dream Messe Miyagi West Hall. In light of the current demand for product quality assurance in the implementation and assembly processes, we will clearly showcase our main equipment aimed at automation, organized by process. We plan to display our X-ray inspection device "FX-400tRX," which, with its high output of 110kV-200μA, is capable of penetrating materials such as 3mm thick copper plates. We invite you to take this opportunity to see our X-ray inspection equipment from IvyBit. We sincerely look forward to your visit.

Our company will be exhibiting at the Electronics Development and Implementation Exhibition starting from January 19, 2022 (Wednesday). We will showcase inspection equipment featuring our unique "X-ray stereo method" and "stereo CT," which allows for tomography imaging in a short time. The "X-ray stereo method" enables inspection of double-sided substrates at a very high speed by canceling the backside with just 2 to 4 shots. The "stereo CT" can capture horizontal cross-sections of any area on the entire surface of the substrate and is compatible with large substrates. We look forward to your visit.

It's dangerous to rely solely on catalogs! Did you know that when comparing numbers, large > small, high > low, and bright > dark can actually reverse in real machines? Some companies may not be getting images with the resolution they imagined from the X-ray equipment they are currently using, or they may not even be aware of this. This document thoroughly explains the necessary points for appropriate equipment selection from various perspectives! We provide all the comparison data of two products with different tube currents using the JIMA test chart. [Contents (excerpt)] ■ Differences between catalog specifications and actual image resolution ■ How X-rays are generated ■ Differences between geometric magnification and monitor magnification ■ The impact of X-rays on semiconductor components *Additionally, we offer verification using actual machines that clearly shows the differences in resolution. About 80% of the companies that conducted the tests have made purchases! If you would like the complete version, please contact us.

Our company will be exhibiting at the "MUSUBI Exhibition" held in Hyogo in October 2021 and in Sendai in April 2022. We plan to showcase the X-ray observation device "FX-400tRX/LL," which enables the acquisition of clear X-ray images with a high resolution of 2μm and a geometric magnification of 500 times. Additionally, we will also display the automatic inspection device for IC wire bonds and lead frames, "LFX-1000." At the exhibition, we will set up a free consultation corner for grants in partnership with TM Human Resources and Labor Consulting, where we will accept applications for manufacturing subsidies for small and medium-sized enterprises at no charge. We sincerely look forward to your visit. 【Features of FX-400tRX/LL】 ■ High-output X-ray source of 1110kV, 2004A allows for penetration of copper plates (3mm) and more ■ Image acquisition of fine details with a high resolution of 2μm ■ High magnification photography with a geometric magnification of 500 times ■ Separation of the front and back surfaces of the mounted circuit board using X-ray stereo method (approximately 4 seconds) ■ Acquisition of 300 layers of horizontal cross-sections of the mounted circuit board using X-ray stereo CT method (approximately 50 seconds) *For more details, please refer to related products and catalogs, or feel free to contact us.