X-ray wafer bump automatic inspection system 'Six-3000'
Transmitting X-rays to the voids inside the wafer! Automatically inspecting the quality of voids above the reference value.
The "Six-3000" is an automatic X-ray inspection device that inspects and determines bumps on wafers. It uses X-rays to penetrate voids inside the wafer and calculates the diameter (area) of the voids from the transmitted images, automatically determining the quality of voids exceeding the reference value. A micro-focus X-ray tube is used as the X-ray source, and an X-ray digital camera is employed for the X-ray detection part, allowing for the extraction of high-resolution images. This enables high-precision void inspection. Additionally, we also offer the silicon wafer crystal defect void inspection device "X-CAS-2." 【Features of Six-3000】 ■ An automatic X-ray inspection device that inspects and determines bumps on wafers ■ Uses X-rays to penetrate voids (bubbles) inside the wafer ■ Automatically determines the quality of voids exceeding the reference value ■ Uses a micro-focus X-ray tube as the X-ray source ■ Employs an X-ray digital camera for the detection part, extracting high-resolution images *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【X-CAS-2 Features】 ■ Inspection is possible regardless of the resistance value of the wafer ■ The sizes of the silicon wafers to be inspected are 12 inches and 8 inches ■ No special qualifications, such as an X-ray supervisor, are required ■ X-rays are completely shielded, making it safe to use *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
