IC wire bonding X-ray inspection device 'LFX-1000R'
This is an introduction to a device that uses X-rays to perform radiographic inspection of the internal condition of reel-shaped IC components.
The IC wire bonding X-ray inspection device "LFX-1000R" is a device that uses X-rays to perform radiographic inspection of the internal condition of reel-type IC components. While winding the ICs from the tape reel, it automatically inspects the connection status of the wire bonding for each individual IC (Good/NG judgment). The compatible reel dimensions range from 180 to 380 mm. 【Features】 ■ Compatible reel dimensions: 180 to 380 mm ■ Radiographic inspection of the internal condition of IC components using X-rays ■ Automatic inspection of the connection status of wire bonding for each individual IC ■ A lead frame compatible type "LFX-1000" is also available *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Inspection Items】 ■ Lead frame position ■ 1st bonding position ■ Wire length ■ Wire break ■ Wire flow ■ 2nd bonding position *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
