IC wire bond/lead frame automatic inspection device LFX-1000
It is an inline X-ray inspection device that automatically inspects the IC wire bond and lead frame condition.
This product is an inline X-ray inspection device capable of fully automated inspection, which inspects the condition of wire bonds and lead frames inside ICs with high speed and high precision. It automatically conveys and inspects the lead frame condition, marking any defective areas. In addition to inspecting wire bonds, it can also inspect for metal foreign objects and lead frame pitch. It can be connected to various types of loaders and unloaders. 【Features】 - Automatic conveyance and inspection in the lead frame condition - Capable of inspecting for metal foreign objects and lead frame pitch - Can be connected to various types of loaders and unloaders - Lead frames can be set directly onto the loader or supplied via a magazine rack *For more details, please refer to the PDF document or feel free to contact us.
basic information
[Option Examples] ■ Automatic loading and unloading of lead frames (loader) ■ Lead frame magazine in the loader section ■ NG marking unit ■ Unloader section * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
