3D stereo inline X-ray inspection device ILX-1100/2000
The cost reduction of inline automatic inspection has been achieved through the 3D X-ray stereo method!
This product is an inline inspection device that automatically inspects the solder joints of mounted circuit boards using X-rays. In high-density circuit boards, the solder joints are located on the bottom surface of the components (face down), making visual inspection impossible. It is suitable for inspecting components like QFN/SON, where the solder joints are on the bottom surface of the components. 【Features】 - Safe design, no qualifications required for handling X-rays - Compact and space-saving, enabling inline X-ray inspection - Can inspect without being affected by the backside of double-sided mounted circuit boards - Capable of 3D tomographic inspection using X-ray stereo method - Supports small circuit boards (50×50mm) to large sizes (510×460mm) - Capable of inspecting bottom-soldered components like BGA using X-ray stereo method *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications】 <ILX-1000/ILX-2000> ■Inspection Method: Capable of arbitrary inspections using 2D transmission inspection, 3D stereo inspection, and 3D tomographic inspection ■X-ray Tube Type: Micro-focus sealed X-ray source ■Board Size / Inspection Area: 50×50 to 510×460mm ■Power Supply: Three-phase AC 200–240V, 3kVA ■Device Dimensions: 1,245 (W) × 1,400 (D) × 1,400 (H) mm ■Device Weight: 1,300kg ■X-ray Leakage Dose: Below 1μSv/h, no X-ray handling qualification required *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
