3D X-ray inspection device 'FX-400tRX with CT'
X-ray stereo method! The resolution has improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section.
This product is an X-ray inspection device that can slice a printed circuit board from the top surface to the bottom surface into 300 layers using X-ray stereo technology (our proprietary technology). The resolution has increased threefold from the conventional 100-layer cross-section to a 300-layer cross-section. The X-ray output is 110kV, 200μA, with a resolution of 2μm. It comes standard with a chip counter function and allows selection from three types of CT methods. 【Features】 ■ X-ray stereo technology (our proprietary technology) ■ Slices the printed circuit board from the top surface to the bottom surface into 300 layers ■ Resolution improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section ■ X-ray output of 110kV, 200μA, with a resolution of 2μm ■ Three types of CT methods (V-CT, diagonal CT, stereo CT) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■Device dimensions: 1300 (W) × 1150 (D) × 1450 (H) mm ■Weight: 1200 kg *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
