Ultra-high precision 3D measurement "Gocator 4000/5000 Series"
Coaxial confocal line sensor
Due to differences in the wavelength spectrum reflected by height, this is a 3D confocal line sensor that accurately measures height. It acquires high-definition 3D data without blind spots through coaxial imaging from directly above. ★ Ultra-high precision and high-speed 3D measurement It performs precise 3D measurements with a maximum X resolution of 1.9μm and a Z resolution of 0.25μm. It supports inline inspections that require speed with a maximum scan rate of over 10kHz and high-speed imaging at 4300Hz even in full scan range. ★ Coaxial optical design without blind spots The coaxial optical design that scans from directly above allows for the acquisition of high-definition 3D data even for shapes with significant irregularities, such as deep grooves and protrusions. High-quality 3D scans are possible even on steep slopes with a maximum inclination of ±85 degrees. ★ Capable of measuring glossy surfaces and transparent objects It can stably capture surfaces composed of various materials, including glossy surfaces, transparent/translucent objects, and soft porous surfaces. It can be applied to shape measurement of glass, inspection of adhesive application amounts for transparent adhesives, and measurement of dicing grooves seen on glossy wafer surfaces.
basic information
[Gocator 4000 Series] - Gocator 4010 - Gocator 4020 The coaxial optical design that scans from directly above allows for the acquisition of high-resolution 3D data even for highly uneven shapes such as deep grooves and protrusions. It can capture images even on steep slopes with a maximum inclination angle of ±85 degrees. [Gocator 5000 Series] - Gocator 5504 - Gocator 5512 - Gocator 5516 This is a confocal optical system where the lenses on the emitting side and the receiving side are arranged to face each other at a 45-degree angle. It is capable of acquiring tomographic data from the surface or interior of transparent multilayer materials. For more details, please download the materials or contact us.
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Applications/Examples of results
- Wire bonding/ball bump defect inspection - Silicon wafer appearance inspection - BGA inspection - Medical microfluidic chip inspection - EV battery explosion-proof valve and welding seam inspection