Hot press machine
Flip Chip Bonder for IC Cards
Supports everything from user-friendly standalone types to inline systems.
basic information
It is a flip chip bonder for IC cards and tag cards. ACF is applied to the film substrate. The mounting of IC chips and the final pressing are performed fully automatically.
Price information
1 million to 100 million yen
Delivery Time
OTHER
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Applications/Examples of results
For IC cards and tag cards.
