Equipment

Equipment
This is an introduction to the equipment we handle.
1~21 item / All 21 items
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Long-distance irradiation N2 plasma unit [capable of irradiation on uneven workpieces]
It is possible to irradiate surfaces with curves and unevenness! Plasma can be irradiated from heights that were not achievable with conventional atmospheric pressure plasma!
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Atmospheric Pressure Argon Plasma ARP Series
This is a head unit for atmospheric pressure plasma using argon gas.
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Atmospheric pressure argon plasma device
Direct plasma method using argon gas
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Heat press machine
TCP crimping machine
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ACF bonding machine
ACF bonding machine
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Hot press machine
Flip Chip Bonder for IC Cards
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Vacuum / Large / Curved Surface Bonding Device
A lineup including vacuum types that prevent air bubbles and models equipped with image processing systems.
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Vacuum Laminating Machine [Touch Panel and LCD Module Laminating Device]
We will bond the panels under vacuum. For the assembly of LCD panels such as tablets and smartphones!
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Large panel lamination device [for lamination processes of films, glass, etc.]
We will bond OCA and film sensors onto large panels. We can accommodate panels up to a maximum size of 850mm x 850mm!
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Curved Surface Laminating Machine [Film and Glass Laminating Device]
Supports curved panels for smartphones, automotive applications, wearables, etc.!
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Mass production compatible atmospheric pressure plasma device 'ILP series'
Standalone type argon plasma device! It is a plasma device for mass production applications.
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Tabletop Argon Atmospheric Pressure Plasma Device
A simple structure argon plasma device! For the modification of small-sized samples.
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Tabletop / Standalone Atmospheric Pressure Plasma Device
A wide variety of simple tabletop atmospheric pressure plasma devices and direct-type devices are featured.
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OCA/OCR Rework Device
Rework expensive panels and LCD modules without damaging them!
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Atmospheric roller laminating machine for bonding large cover glass and panels.
Roller lamination with atmospheric pressure! A laminating machine compatible with large cover panels.
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Vacuum alignment bonding machine
Equipped with a unique imaging system! High-precision bonding is possible under vacuum conditions.
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Glove for glove box
Gloves for glove boxes that are resistant to radiation.
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Curved surface and S-shaped cover glass bonding device
A wide range of products suitable for laminating "large cover glass + AG/AR film" is available.
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Laser processing machine for ultra-fine coaxial cables.
We provide solutions for processing ultra-fine wires of AWG 36 and below, which are difficult to handle with mechanical cutters.
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Centrifugal Vacuum Mixer "High-Rotor Series" with Self-Rotation and Revolution
Adopting our unique stirring mechanism! We have achieved reproducibility from research and development to mass production.
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Contributing to extensive batch processing! Plasma cleaning equipment
"Advanced Visible Plasma" is recommended for processing three-dimensional objects and thick workpieces, such as 3D glass and PCBs.
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