All products and services
61～75 item / All 75 items
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Custom-made production achievements: Various vacuum devices
Conducting sample processing with a demo unit! We have a track record of "annealing equipment for research and development" and more.
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Oxide/Nitride Plasma CVD Equipment
Controllable extensive membrane properties! Significant particle reduction and improved productivity.
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Custom-made production achievements: Vapor deposition equipment
We have a track record of devices such as the "two-stage composite Pt deposition system"! Please contact us when you need assistance.
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Vacuum heating drying oven
Vacuum drying of sputter targets, vacuum components, and fixtures can be utilized!
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Multi-target sputtering device
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
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Organic EL evaporation device
You can freely choose from the plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, and more!
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Sputtering device for three-dimensional objects
Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!
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Plasma CVD device for three-dimensional objects
A simple structure with high versatility! It adopts a unique plasma control method.
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【Thorough Developer Perspective】Custom manufacturing of various devices available.
Consultations are welcome! We handle everything in-house from design to manufacturing and assembly! If you are having trouble with various equipment manufacturing, please feel free to consult with us. *Case study materials are currently available.
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Pressurized RTA device
Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!
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Epitaxial-EB deposition device
A high-temperature process of up to 900°C is possible! This product is suitable for single crystal film formation due to the epitaxial promotion mechanism.
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High-Rate Deposition. Piezoelectric Film Formation Sputtering Device
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
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High-Rate Depo. Piezoelectric Film Formation Sputtering Device
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
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Assing device
It is a versatile and compact device that enables etching, ashing, and ion cleaning!
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Screw stirring type powder sputtering device
Space-saving and large capacity! Custom-made options are also available to meet various requests!
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