Electronic Ceramics (Thin film integrated circuit components & Substrates)
A thin film integrated circuit pattern will be formed on a ceramic substrate.
By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.
basic information
As a substrate manufacturer, we are capable of comprehensive technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.
Price range
Delivery Time
Applications/Examples of results
○ Submounts and subcarriers for photodiodes and laser diodes ○ Circuit boards for transmitters and receivers used in microwave and millimeter wave bands (amplifier circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.) ○ Small resistor arrays Circuit boards for measuring instruments Circuit boards for communication devices and radar ○ Circuit boards for sensor heads Components for synthesizers and splitters for optical submarine cables ○ Various types of circuit boards
