JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office Official site

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

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As a substrate manufacturer, we are capable of comprehensive technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.

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Applications/Examples of results

○ Submounts and subcarriers for photodiodes and laser diodes ○ Circuit boards for transmitters and receivers used in microwave and millimeter wave bands (amplifier circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.) ○ Small resistor arrays Circuit boards for measuring instruments Circuit boards for communication devices and radar ○ Circuit boards for sensor heads Components for synthesizers and splitters for optical submarine cables ○ Various types of circuit boards

Electronic Ceramics Comprehensive Catalog JFC

CATALOG

[Development Product] Step-type ceramic substrate and thin-film integrated circuit formation

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Thin Film Integrated Circuit Components (MIC)

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Fine patterning technology that achieves miniaturization and high precision.

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[Example of Use] Sensor 99.9% Alumina Substrate

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Ceramics Substrate Catalog

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High-strength alumina substrate for thin films

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[Design Examples and Technology Introduction] High-Frequency Solutions

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JGC Group SEMICON JAPAN 2024 Exhibition Information

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As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).