エレクトロニクセラミックス
エレクトロニクセラミックス
光通信用基板、センサー用基板、無線通信用基板などのセラミックス基板を取り扱っております。セラミックス基板に薄膜集積回路を形成いたします。
1～9 件を表示 ／ 全 9 件
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Thin-film integrated circuit components
Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.
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High-quality alumina substrate
Birth of a substrate utilizing new materials.
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Ultra-high precision thin-film resistors
Achieved an extremely low temperature coefficient of resistance (extremely low TCR) that was not seen before, based on Ta2Nx (tantalum nitride) material with excellent environmental resistance through special film treatment technology.
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AuSn solder
By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.
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[Example of Use] Sensor 99.9% Alumina Substrate
A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.
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5G ceramic substrates and thin-film integrated circuits achieving miniaturization and high precision.
●Fine circuit pattern Line/Space: 30μm/30μm ●Pattern dimension accuracy: ±10μm
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Formation of thin-film integrated circuits on stepped ceramic substrates.
We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.
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[Development Information] High Dielectric Constant Substrate / Single-layer Capacitor
The single-layer capacitor developed by JFC suppresses inductance components and achieves excellent characteristics even at high frequencies.
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Electronic Ceramics (Thin film integrated circuit components & Substrates)
A thin film integrated circuit pattern will be formed on a ceramic substrate.
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