5G ceramic substrates and thin-film integrated circuits achieving miniaturization and high precision.
●Fine circuit pattern Line/Space: 30μm/30μm ●Pattern dimension accuracy: ±10μm
We form thin-film integrated circuits on various high-intensity, high thermal conductivity ceramic substrates. ● Formation of air bridges, side patterns (0.3t or more), and AuSn solder patterns ● Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors ● Circuit formation with low dielectric loss and low noise in the high-frequency range through the combination of our unique 99.9% alumina substrate and fine patterns ● Substrate materials: alumina, aluminum nitride, zirconia, quartz
basic information
As a substrate manufacturer, we are able to provide comprehensive technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.
Price range
Delivery Time
Applications/Examples of results
- Submounts and subcarriers for photodiodes and laser diodes - Circuit boards for transmitters and receivers used in microwave and millimeter wave bands (amplifier circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.) - Small resistor arrays Circuit boards for measuring instruments Circuit boards for communication devices and radar - Circuit boards for sensor heads Components for synthesizers and splitters for optical submarine cables - Various types of circuit boards
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Fine patterning technology that achieves miniaturization and high precision.
