Improvement Case Using Wafer Chuck with SiC/Si Composite Material
We will introduce examples of problem-solving using JFC's unique metal ceramic composite materials (MMC) based on our achievements. Please refer to the catalog (PDF).
The composite material MMC combines the lightweight properties of aluminum with the rigidity of steel, featuring high thermal conductivity and low thermal expansion. The composite material of SiC and Si is poreless and has a particle prevention effect, making it suitable for wafer chucks. 【Main Features】 ■ Lightweight ■ High Rigidity ■ High Thermal Conductivity ■ Low Thermal Expansion ■ Wear Resistance 【Adoption Effects】 JFC's unique composite material MMC (Metal Matrix Composites) brings numerous benefits, such as improved equipment performance and energy efficiency due to its lightweight and high rigidity, solutions to thermal issues from high thermal conductivity and low thermal expansion, and reduced assembly man-hours through the integration of parts using casting methods. It is being adopted in various fields. *For details, please refer to the materials available for download via the PDF button. We also welcome inquiries through the contact button.
basic information
<Composite Material Lineup> ■SA Series Casting (SA301, SA401) Contains 30-40 vol% SiC ceramic particles in aluminum alloy. ■SA Series Infiltration (SA701) Aluminum infiltrated into SiC ceramic porous body (70 vol%). ■SS Series Infiltration (SS501, SS701) Metallic silicon infiltrated into SiC ceramic porous body (50-70 vol%).
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Applications/Examples of results
- Semiconductor manufacturing equipment / inspection equipment - FPD manufacturing equipment / inspection equipment - Mounters, bonders - Machine tools - Robots - Various heat dissipation plates - Optical system components
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