High precision through equipment introduction - Zygo laser interferometer, ultra-precision surface grinder.
The introduction of an interferometer that measures within one of the largest measurement ranges in the country with nanometer precision, along with a super-precision surface grinding machine equipped with oil hydrostatic guidance and precision machining systems, has achieved high precision in products.
With the new introduction of the "Zygo laser interferometer" and "ultra-precision surface grinding machine," we are now able to deliver ceramic parts and metal matrix composite (MMC) parts with even higher precision. We also meet the advanced demands of cutting-edge fields such as "semiconductors" and "space." We provide optimal solutions from our extensive lineup. Please feel free to consult with us. ■ Laser interferometer: Evaluates surfaces of up to 450mm x 1,000mm with nm precision, one of the largest in Japan. ■ Ultra-precision surface grinding machine: Ultra-high precision (below 1μm) with versatile shape processing (straight, flat, uneven, etc.).
basic information
【Specifications of Newly Introduced Equipment】 Laser Interferometer ・Camera Resolution: 1,200x1,200 pixels ・Wavelength λ: 633nm ・Reproducibility: 0.06nm, λ/10,000 (2δ) ・Measurement Range TF: 450mm ・Measurement Range RF: 1,000mm Ultra-Precision Surface Grinding Machine ・Table Working Surface: 2,000x600mm ・Stroke: X: 2,600mm Y: 625mm Z: 720mm
Price range
Delivery Time
Applications/Examples of results
<Semiconductor Inspection Equipment / Stage Components> ● Example 1: [Size] 690x45mm [Material] SS701 (Metal-Ceramic Composite) [Flatness] 0.543μm* ● Example 2: [Size] 918x60mm [Material] SS701 (Metal-Ceramic Composite) [Flatness] 0.745μm* <Semiconductor Manufacturing Equipment / Vacuum Suction Chuck> [Surface Accuracy of Pin Chuck Section] Overall PV 0.209μm* *Evaluated with Zygo Laser Interferometer
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