High-strength alumina substrate for thin films
Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.
The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.
basic information
●Features - High purity of alumina, excellent environmental resistance. - High strength, resistant to cracking even when the substrate is thinned. - Superior flatness and smoothness of the substrate surface, with few voids, making it suitable for thin film circuit formation. ●Applications Substrates for various temperature sensors, chip resistors, and high-frequency components. *As a substrate manufacturer, we are capable of comprehensive technology development, quality assurance, and problem-solving. We respond quickly to short lead times and design changes. Please feel free to consult with us.*
Price range
Delivery Time
Applications/Examples of results
● Boards for various temperature sensors ● Boards for chip resistors ● Boards for high-frequency components
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High-strength alumina substrate for thin films
