[Applicable Case] Semiconductor Manufacturing Equipment Metal Ceramic Composite Material 'MMC'
The joining technology of composite materials MMC has made it possible to expand into new applications.
The manufacturing of hollow structures has become possible by joining MMCs together. It is possible to flow refrigerants or gases through the internal channels formed by the joining technology. MMCs, characterized by high thermal conductivity and low thermal expansion, experience minimal thermal deformation due to temperature changes, preventing adverse effects on the components they are integrated with. <Applications for Cooling Jackets> Prevention of arcing due to reduced thermal expansion differences with alumina ESC, improved etching rates due to high thermal conductivity and low thermal expansion. <Applications for Wafer Chucks> Stable measurements and expanded test temperature ranges due to high rigidity, high thermal conductivity, and low thermal expansion. 【Features of MMC】 ■ Weight comparable to aluminum, about 1/3 that of iron ■ Rigidity equivalent to that of iron and steel, resistant to bending ■ High thermal conductivity and heat dissipation ■ Minimal thermal shrinkage 【Joining Methods】 ● Brazing: Joining using a filler material with a lower melting point than the base material. ● Diffusion bonding: Joining by closely adhering materials and diffusing the atoms at the bonding interface. *Joining of dissimilar materials is also possible (consultation for joinable materials is available). *There is also a track record of joining multiple sheets. For more details, please download the catalog or contact us.
basic information
<Series Lineup> ■SA Series Casting (SA301, SA401) A composite material containing 30-40 vol% SiC ceramic particles within aluminum alloy. ■SA Series Impregnation (SA701) A composite material with aluminum impregnated into SiC ceramic porous body (70 vol%). ■SS Series Impregnation (SS501, SS701) A composite material with metallic silicon impregnated into SiC ceramic porous body (50-70 vol%).
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Applications/Examples of results
■ Application to Electrostatic Chucks (ESC) - For 3D-NAND etching equipment: 'Cooling Jacket' <Benefits> - Prevention of peeling of alumina ESC and alumina thermal spray - Prevention of micro-cracks on the surface → Prevention of arcing - Increased etching rate due to improved thermal conductivity and reduced thermal expansion → Increased production capacity ■ Application to Conductive Prober Chucks - For prober equipment: SiC/Si 'Wafer Chuck' <Benefits> - Expanded testable temperature range ex) Room temperature to 200°C → -50°C to 300°C - Improved stability of the measured wafers
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