[SEMICON Exhibition] Ceramics, Composite Materials MMC
We will jointly exhibit at "SEMICON JAPAN 2024" held in Tokyo BS. We will introduce products and application examples related to semiconductors.
<JGC Group Exhibition Overview> Since its founding, the JGC Group has contributed to various fields, including EPC (Engineering, Procurement, Construction) for plants and factories, particularly in oil refining and natural gas, as well as in diverse businesses such as the manufacturing of catalysts and fine ceramics. In the semiconductor field, we support the semiconductor industry from multiple angles, focusing on "design and construction of semiconductor-related factories," "components for semiconductor manufacturing equipment," and "materials for semiconductor materials." <JFC Exhibits> In the Japan Fine Ceramics corner, we will introduce products and application examples related to semiconductors. ● Guide beams made of metal-ceramic composite materials ● Large trays, stages, and pin chucks made of SiC ● Ceramic substrates and thin-film metallized substrates ● Solid electrolytes, Li-ion sensing films, SOFC/SOEC cells, pressure sensors for hydrogen environments <Exhibition Dates/Venue> ● Dates: December 13 (Wednesday) to 15 (Friday), 2024, 10:00 AM - 5:00 PM ● Venue: Tokyo Big Sight, East Hall 5, Booth No. 6032 ● JGC Holdings Booth, Japan Fine Ceramics *This exhibition requires prior registration (free admission).
basic information
<Engineering Ceramics> ● Silicon Carbide: Our specialty, with minimal strength reduction at high temperatures and excellent corrosion and wear resistance. ● Silicon Nitride: Excellent thermal shock resistance and well-balanced material properties. ● Alumina: A popular ceramic. ● Zirconia: High mechanical strength at room temperature and significant fracture toughness. <Metal Matrix Composites (MMC)> ■ SA301, SA401: Cast products containing 30-40 vol% SiC particles in aluminum alloy. ■ SA701: Aluminum infiltrated into SiC porous body (70 vol%). ■ SS501, SS701: Metal silicon infiltrated into SiC porous body (50-70 vol%). <Electronics Ceramics> 【Thin Film Integrated Circuits】Patterning of integrated circuits on various ceramic substrates. ● Side patterns (0.3t or more), formation of AuSn solder patterns. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors. ● Combination of our unique 99.9% alumina substrate and fine patterns enables the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● High dielectric substrates, ALN substrates, and quartz substrates are also supported. 【High-Quality Alumina Substrates】 ● Dense ● Three-point bending strength of 660 MPa (approximately twice that of conventional materials). ● Good electrical properties with low dielectric loss in high-frequency bands.
Price range
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Applications/Examples of results
■ Application to Electrostatic Chucks (ESC) - For 3D-NAND etching equipment: SiC/Al 'Cooling Jacket' <Benefits> - Prevention of peeling of alumina ESC and alumina thermal spray - Prevention of surface micro-cracks → Prevention of arcing - Increased etching rate due to improved thermal conductivity and reduced thermal expansion → Increased production capacity ■ Application to Conductive Prober Chucks - For prober equipment: SiC/Si 'Wafer Chuck' <Benefits> - Expanded testable temperature range ex) Room temperature to 200°C → -50°C to 300°C - Improved stability of the measured wafers ■ Application to Pin Chucks - For exposure and inspection equipment: SiC and SiC/Si 'Pin Chuck' <Benefits> - High precision processing with overall flatness of 0.3μm and local flatness of less than 0.05μm. - Reduction of wafer contact area by forming multi-stage pins, preventing particle adhesion. Formation of 2-stage and 3-stage pins is possible.
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