Contribution to semiconductor integration and 3D development! Effects of adopting composite materials MMC.
Composite materials MMC enhance the performance of semiconductor manufacturing equipment - MMC components with high thermal conductivity, low thermal expansion, lightweight, high rigidity, and high precision improve equipment performance.
■MMC Adoption Effects Changed the cooling jacket from aluminum to composite material MMC (SA701) - Reduced thermal expansion difference with alumina ESC → Thermal expansion rate equivalent to alumina 7x10^-6/K - Improved thermal conductivity → 15% increase over aluminum (thermal conductivity: 160W/m·K) *Internal flow paths will be formed in the cooling jacket using MMC bonding technology. ■Development Information Currently developing SiC/Si-Al composite materials. Minimizing the thermal expansion difference with the next-generation "Aluminum Nitride ESC." ■High-Precision Processing New equipment has been added to high-precision processing technology, enabling the provision of larger MMC products with even higher precision. ○ Introduction of a laser interferometer (manufactured by Zygo) boasting one of the largest measurement ranges in Japan ○ Introduction of an ultra-high precision surface grinding machine (manufactured by Nagase Integrex) ■■■ Exhibiting as the JGC Group at "SEMICON Japan 2025" ■■■ Dates: December 17 (Wed) - 19 (Fri), 2025, 10:00-17:00 Venue: Tokyo Big Sight (West Hall 1) Booth: JGC Holdings (Booth No. W1165) We will showcase technology development for composite materials, ceramics, and the semiconductor, environmental, and energy sectors. We look forward to your visit.
basic information
Composite materials MMC, which possess various features such as high thermal conductivity, low thermal expansion, lightweight, high rigidity, and high vibration damping, greatly contribute to the performance improvement of semiconductor manufacturing equipment. 【Features】*Property values are for SA701 - High thermal conductivity: 160 W/m·K - Low thermal expansion: 7 x 10^-6/K - Lightweight: 3.0 g/cm³ - High rigidity: Young's modulus: 260 GPa <Series Lineup> ■SA Series Casting (SA301, SA401) Composite materials containing 30-40 vol% SiC ceramic particles within aluminum alloy. ■SA Series Impregnation (SA701) Composite materials with aluminum impregnated into SiC ceramic porous bodies (70 vol%). ■SS Series Impregnation (SS501, SS701) Composite materials with metallic silicon impregnated into SiC ceramic porous bodies (50-70 vol%). For inquiries and requests for materials, please contact us through our website: https://www.japan-fc.co.jp/
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■Semiconductor manufacturing equipment ・Inspection equipment ・Exposure equipment ■FPD manufacturing equipment / Inspection equipment ■Industrial machinery ・Chip mounter ・Machine tools ・High-speed press machines ■Automotive-related ・Suspension components ・EV-related components
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As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).