Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!
The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.
basic information
■Basic Specifications - Maximum workpiece size that can be cut: φ100mm (75mm square) - Maximum workpiece height that can be cut: 9mm - Device dimensions (WxDxH): 650x905x1,350mm - Device weight: 380kg *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
Model number/Brand name
High-Tech Industrial Manufacturing Co., Ltd. Ultrasonic Cutting Device for Cross-Section Observation 'CSX-100Lab'
Applications/Examples of results
Smartphone, camera module, ultra-small chips (0402, 0201, etc.), mounting boards, MEMS, PCB, LSI packages, TSV (Through-Silicon Via, silicon through electrode), etc.
