Ultrasonic cutting device
Ultrasonic cutting device
This is a page for ultrasonic cutting devices.
1～8 item / All 8 items
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Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!
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Takeda Industrial's ultrasonic cutting device 'CSX501'
Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!
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Takeda Industrial's ultrasonic cutting device 'CSX-400 Series'
Achieving high-quality and high-efficiency cutting of various materials, from difficult-to-cut materials like SiC and LTCC to composite materials such as glass and resin!
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Takeda Industrial's mass production sheet-type wet processing equipment 'TWP Series'
A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!
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Takeda Industrial's experimental single-sheet wet processing device "TWPm Series"
A prototype sheet-type resist stripping and lift-off device for wafer surface treatment using the lift-off resist stripping process!
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Takeda Industrial's batch-type wafer automatic cleaning device 'TWS Series'
Batch cleaning equipment utilizing cleaning technology and transport/control technology, compatible with various chemical solutions!
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Takeda Industrial's IPA Steam Cleaning Device "TID Series"
IPA steam cleaning and drying equipment! Achieving clean drying for devices, wafers, glass, and parts!
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Takahashi Industrial's dicing frame cleaning device 'TFC Series'
A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!
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