Takeda Industrial's mass production sheet-type wet processing equipment 'TWP Series'

A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!

The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.

basic information

■Basic Specifications - Material: Si, compounds (GaAs, InP, Sapphire, SiC, GaN), etc. - Size: 2, 3, 4, 5, 6, 8 inches (compatible with 2 sizes) - Scrubbing treatment: High-pressure jet / 2-fluid jet / ultrasonic shower, etc. - Number of processing chambers: 2, 4 chambers - Processing liquids: Organic stripping solution, rinse solution, pure water - Chemical supply: Chemical circulation recovery, filtration, and temperature control system - Work transport: Double-arm SCARA robot - Spin chuck: Vacuum chuck *Mechanical chuck available as an option - Equipment dimensions (WxDxH): 1,900x2,700x2,200mm (2 chambers) 1,900x4,100x2,200mm (4 chambers) - Safety features including automatic fire extinguishing system and explosion-proof glass - Automatic cleaning function inside the chamber - Various nozzle specifications can be changed - Backside wraparound prevention function *For more details, please refer to the PDF document or feel free to contact us.