Takeda Industrial's experimental single-sheet wet processing device "TWPm Series"

A prototype sheet-type resist stripping and lift-off device for wafer surface treatment using the lift-off resist stripping process!

The prototype research device "TWPm Series" has the following features: ■ Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate small quantities of various types and fluctuations in production volume - Enhanced quality and yield through sheet processing (realization of precise processing without cross-contamination and improved uniformity and control within the plane) - Unique jet lift-off mechanism with high peeling performance - Achieved reduced footprint through compact size - Maintenance-free structure from the back - Functions inherited from conventional products - Dedicated device for one chamber * There is also a mass production "TWP Series." https://www.ipros.jp/product/detail/2000745622 * For more details, please refer to the PDF document or feel free to contact us.

basic information

■Basic Specifications - Material: Si, compounds (GaAs, InP, Sapphire, SiC, GaN), etc. - Size: 2, 3, 4, 5, 6, 8 inches (compatible with two sizes) - Number of cleaning chambers: 1 - Scrubbing treatment: high-pressure jet / two-fluid jet / ultrasonic shower, etc. - Number of processing chambers: 2, 4 chambers - Processing liquids: organic stripping solution, rinse solution, pure water - Chemical supply: chemical circulation recovery, filtration, and temperature control system - Transport robot: transport unit - Spin chuck: vacuum chuck *Mechanical chuck compatible as an option - Equipment dimensions (WxDxH): 1,200 x 1,500 x 2,000 mm - Safety features including automatic fire extinguishing system and explosion-proof glass - Automatic cleaning function inside the chamber - Various nozzle specifications can be changed - Backside wrap prevention feature *For more details, please refer to the PDF document or feel free to contact us.