Simultaneous dual-side marking shortens the takt time. Contributes to the acceleration of communication equipment manufacturing.

In the telecommunications industry, the demand for high-speed and high-density PCB substrates is expanding with the proliferation of 5G and IoT. In the manufacturing process, there is a need to efficiently produce high-quality products, and the acceleration of the marking process is particularly important. Traditional marking methods posed risks of quality degradation due to increased tact time and positional misalignment. Our PCB inline laser marker significantly reduces tact time by marking both sides of the substrate simultaneously with its dual-head structure. With XY drive heads and CCD substrate recognition, it achieves high-precision marking, contributing to the reliability of communication devices. 【Usage Scenarios】 - 5G-compatible base stations - High-speed communication routers - IoT devices 【Benefits of Implementation】 - Increased productivity through reduced tact time - Improved quality through high-precision marking - Traceability management through MES integration

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