New Technology | IH Soldering Equipment Achieves Soldering through Non-Contact and Induction Heating
Non-contact and localized heating suppresses temperature rise in surrounding components. Parts that are difficult to heat and parts that are sensitive to heat can be joined with a single unit.
The IH soldering device 'S-WAVE' enables non-contact and pinpoint heating, allowing for soldering in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and high-efficiency soldering even on high-density printed circuit boards. Even on boards with components that have a large difference in thermal capacity, it can be completed in one process, leading to improved productivity. 【Features】 ■ Compatible with terminals from φ0.3 to 1.5mm ■ Contributes to the automation of hand soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-warm areas ■ Achieves high-precision and high-speed soldering *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo unit, please contact us through the inquiry form.
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【Other Features】 - Automatic alignment and post-heat treatment are possible. - No waste solder is produced, and power consumption can be reduced, resulting in low environmental impact. - IH power output can be controlled, allowing heating characteristics to be freely set for each point. - For terminals with a diameter of 0.6mm and a copper thickness of 70μm, the heating time is 3 seconds per point. *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo machine, please contact us through the inquiry form.
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*For more details, please refer to the materials. Feel free to contact us as well.*
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